Silicom F2010X-PL Data Center NIC (F2000X-PL)

Intel® based F2000X-PL Data Center NIC

Silicom F2010X-PL is an advanced data processing network interface controller, featuring cutting edge I/O and data processing capabilities, optimized for virtualized cloud, cloud native or bare metal virtualization. The card are is based on Intel’s design called F2000X-PL Silicom

F2010X-PL can be offered with complete implementation of I/O workload using industry standard interfaces, allowing Silicom F2010X-PL to be operated using stock virtio and NVMe drivers, implementing a true hardware virtio and NVMe PCIe interface e.g. offering full stack offload of NVMeoF for TCP.

Combining two powerful engines – Intel® Agilex™ F-Series AGFC023 FPGA and Intel® Xeon® D-1736 SoC (x86 CPU, 8 cores, 16 threads) –the Silicom F2010X-PL data processing NIC brings together the power and flexibility of FPGA and the flexibility of the x86 ecosystem.

A unique 3-way path for application optimization guarantees fast results. The presence of a x86 based CPU allows you to leverage existing software assets, where the FPGA flexibly enables extremely performant data path implementation:

1) In the first stage, the card can serve as a standard NIC with minimal configuration changes, with minimal orchestration modification.
2) The second stage includes a migration of data plane and VM switching functionality from main host down to x86 CPU cores on the card.
3) The third stage involves data path implementation on the FPGA.

Using the offered IP, the Silicom F2010X-PL can be developed and deployed as a virtio network accelerator, a virtio storage accelerator, a NVMe storage (network) controller, a RDMA OFED controller, either separately or all at the same time. Further implementations such as flow
filtering, encryption, compression, deduplication, and machine learning, are facilitated by F2010X- PL features as complete infrastructure implementation on a NIC.

As the data path is implemented on the card, fewer risks and vulnerabilities are left to the cloud data center infrastructure. The card can be operated as a host isolated entity for bare metal deployments where no management is possible from the host side.

Storage data paths in a cloud environment are often associated with the use of a storage attached network (SAN), serving the compute nodes over the network. The use of an x86 CPU core NIC with FPGA allows relatively easy implementation of storage volume virtualizations, accessible on the host using stock storage software stacks, such as NVMe.

Key Use Cases

  • Virtual Cloud
  • Bare Metal Cloud
  • NVFi
  • Secure InfrastructureCloud Storage

Key features

▪ Intel® Agilex™ F-Series AGFC023
▪ Intel® Xeon® D-1736 @ 2.3GHz 8 core, 16 threads
▪ Can support virtio-net and virtio-blk over PCIe
▪ Dual 100GbE
▪ PCIe v4 x16 host to FPGA (connector)
▪ PCIe v4 x16 SoC to FPGA (onboard)



Network Interface

IEEE standard IEEE 802.3 100GE
Interfaces ▪ Physical interface: 2 x QSFP28/56 slots
▪ Supports QSFP+/QSFP28 modules with Multimode SR (850nm), single mode LR (1310nm), multimode LRM (1310 nm), or Direct Attached Copper (Twinax) and others
▪ Data rate: 2×100 Gbps
▪ Support for SyncE


Network ▪ Dual 100GbE, using QSFP28/56
Host ▪ PCIe gen4 x16 to FPGA
▪ Support for SMBUS/I2C
SoC ▪ PCIe gen4 x16 to FPGA


General Technical Specifications

SoC details Intel® Xeon® D-1736
▪ 8 x86 64-bit cores @2.3GHz
▪ 16 threads
▪ 15 MB cache
▪ 3.4 GHz Max Turbo Frequency
▪ Alternative SoC model on request
FPGA Details Intel® Agilex™ F-Series AGFC023
▪ Intel® Hyperflex™ core architecture
▪ Intel® Embedded Multi-die Interconnect Bridge (EMIB)
▪ PCIe Gen4 x16 hard IP
▪ Fixed point and IEEE 754 compliant floating-point variable precision, Multiply, Multiply and Accumulate, digital signal processing (DSP) block
▪ 1640 DSP blocks
▪ 2308080 LE
▪ 246 Mb On-Chip Memory
▪ Quad-core 64-bit Arm® Cortex®-A53 embedded processor @1.5 GHz
▪ Alternative FPGA model on request
Configuration ▪ Configuration flash can be made to support multiple boot images for automatic fallback to fail safe boot image
▪ Direct FPGA configuration via the onboard JTAG dongle
▪ Option for FPGA configuration management via SoC
▪ Option for upload of FPGA configuration to flash via PCIe
On-board Memory ▪ 16GB DDR ECC for SoC
▪ 16GB, 4×4 GB DDR4 (ECC, 40b, 2666MT) for FPGA
▪ 64 GB NVMe in M.2 slot for SoC Operating System and storage
▪ 2GB Configuration flash RAM for boot images
On-board Clock ▪ PCIe clock: 100 MHz
▪ Core Clock 125Mhz
▪ 2 x differential 312.5 MHz SerDes clock for Ethernet
▪ 2 x differential 266.67 MHz/300MHz/333.33MHz clock for Memory
▪ Calibration clock 125MHz, 100MHz, 25MHz
▪ 50 MHz clock
Additional Board Support ▪ On-board power and temperature sensors (via SMBus/I2C/PLDM)
▪ FPGA controlled Link and Activity LED for each port. 2 for each QSFP28
▪ Board status LEDs
▪ FPGA Reset via host I2C
Environment ▪ Full height, 3/4 length
▪ Single PCIe slot
▪ Storage temperature: -30 – 70°C, -22 – 158°F
▪ Operating temperature (card inlet): 0 – 55°C, 30 – 130°F
▪ Operating humidity: 20 – 80%
▪ Hardware compliance: RoHS, REACH, FCC, CE, UKCA
Power ▪ Max 150W
▪ Consumption dependent on FPGA and CPU utilization
▪ Passive cooling
▪ Power and temperature monitoring via SMBus/I2C/PLDM
Management ▪ SoC boot options: PXE, USB, NVMe
▪ SoC control interfaces: USB, UART, network, option for Host
Networking ▪ A configurable packet processor IP core
▪ Intel ASAF FPGA Interface Manager
▪ Extensive configuration API
▪ Packet forwarding and bridging across network, main host and SoC
▪ Parsing, match and action operations
▪ Bandwidth rate limit
Supported ▪ Intel® Acceleration Stack for Intel® Xeon® CPU with FPGAs
▪ Intel® Quartus® Prime Software
▪ Data Plane Development Kit (DPDK)
▪ Storage Performance Development Kit (SPDK)
▪ Infrastructure Programmer Development Kit (IPDK)


Ordering Information

FB2CG@AGF23D76-PB F2010X-PL, 2x QSFP28/56, FPGA AGF023, SoC Xean D-1736 16 GB + 16GB DDR4

Resources and Downloads

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